Highcon is a premium sponsor of Packaging News Live 2016 which promises to bring the very best insight on packaging innovation, manufacturing and design – as well as fantastic networking opportunities – to packaging designers, technologists and manufacturers alike.
The conference will feature:
Eshchar Ben-Shitrit, VP Marketing, will be speaking about how digital technology can impact design creativity and production capability in the packaging supply chain.
Highcon exhibiting at the FEFCO Technical Seminar, 2023 on 25-27 October 2023 in Lyon Convention Centre