Meet Highcon at FEFCO Technical Seminar

Highcon will be attending the FEFCO Technical Seminar from October 9-11, 2019 for the first time!

 

Come learn about Highcon digital cutting and creasing technology and visit our stand #129, Hall 1 at the Palexpo in Geneva, Switzerland.

We will be displaying a wide range of samples produced by customers on our digital cutting and creasing machine, engineered for corrugated board, the Highcon Euclid IIIC. This is an excellent opportunity for you to see real customer applications, and get answers to your questions.

During the seminar you will have a chance to hear from Aviv Ratzman, Highcon Co-Founder, and CMO, in the Spotlight Session on Thursday, October 10th between 12:00 – 13:00 where he will discuss Agile Production with Digital Finishing in the Corrugated market and how it impacts our customers’ business. Learn how finishing is the smart way to go digital.

Care for a sneak peek at some of the topics we will discuss? click here

Follow our updates to get the date and time we will present.

Want to win a free entrance to the exhibition?

 

We are excited to offer a free entrance ticket to the exhibition to the first five people who register.

Simply click here to submit your request and let us take care of the rest.

The form will be open for registration from August 31st

Interested in learning more about Highcon technology?

 

If you don’t want a free ticket but are interested in receiving a corrugated sample kit, we would be happy to send you some corrugated samples produced by our customers world-wide.

Click here to submit your request and the kit will be on its way.

 

 

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