IADD FSEA Odyssey 2017

  • blankMay 17-19
  • blankChicago, IL
blank
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May 17-19, 2017, Chicago, IL

For the fourth time, Highcon will participate in the IADD-FSEA Odyssey in Chicago, IL on May 17-19, 2017.
On our booth we will be showing samples, produced on our Highcon Beam and Highcon Euclid III digital cutting and creasing products.
The samples will demonstrate the wide range of innovative applications made possible by Highcon technology.
We will also have a Highcon Axis Web-to-Pack station running live demonstrations.

Demo2 Owl3 Demo3
Highcon invites you to see a live demo of the Highcon Euclid III digital cutting and creasing machine at the Komori Print Center on Friday, May 19.
This is an excellent opportunity to see the real thing in operation after hearing our session at the IADD FSEA where we will be speaking about the benefits of the digital cutting and creasing process. A special 3D Owl, produced on the Highcon Euclid, will be given to attendees during the demo.
Buses will leave from the Renaissance Hotel at 6:45am and return at 8:30am in plenty of time for the first program sessions. Coffee and donuts will be served during the demo.
Please note the registration is limited to the first 50 respondents and will be confirmed on a first come – first served basis.

 

 

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