For the fourth time, Highcon will participate in the IADD-FSEA Odyssey in Chicago, IL on May 17-19, 2017.
On our booth we will be showing samples, produced on our Highcon Beam and Highcon Euclid III digital cutting and creasing products.
The samples will demonstrate the wide range of innovative applications made possible by Highcon technology.
We will also have a Highcon Axis Web-to-Pack station running live demonstrations.
Highcon exhibiting at the FEFCO Technical Seminar, 2023 on 25-27 October 2023 in Lyon Convention Centre