Highcon @ FESPA – Hall 5.2 Booth D-21

  • blankMay 15-18 2018
  • blankBerlin
We will be showing our latest corrugated samples digitally cut & creased on the Highcon Euclid IIIC at our customer site, LxBxH Verpackungen nach Mass, Switzerland.
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Visit the Highcon booth #D21 at the 2018 FESPA event in Berlin!

We will be showing our latest corrugated samples digitally cut & creased on the Highcon Euclid IIIC at our customer site, LxBxH Verpackungen nach Mass, Switzerland.
Our samples demonstrate many of the Highcon Euclid IIIC capabilities – including digital creasing, cutting, perforations, zipper tears, half cuts and special decoration elements.

 

blankOrder your corrugated covered Laderach chocolate box!

The corrugated sleeve produced on the Highcon Euclid IIIC. 
Fill in your details below, and the box will be waiting to you on our booth hall 5.2 stand D-21.

 

 

 

 

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Meet, Drink & Chat with Silvano Gauch – President, LxBxH Verpackungen nach Mass!

On Tuesday & Wednesday 16th and 17th May, between 13:30 – 15:00 at the Highcon booth – we invite you to a beer and chat with Silvano Gauch, President of LxBxH to talk about his day-to-day work with the Highcon Euclid IIIC for corrugated board. Silvano will answer your questions about machine capabilities, benefits, daily workflow and other pecifications.

 

 

To order your corrugated covered chocolate box, or to meet with Silvan Gauch, president of LxBxH, simply fill in your details in the form below.
We will than contact you by email with your confirmation of request.
The box will be waiting for you with your name at the Highcon booth – throughout the FESPA show.
(Please note the quantity is limited for the first 200 people who register).

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