In Atlanta, Georgia, HP-Scodix-Highcon will be hosting an Open House event showcasing the latest solutions in digital technologies, including a live demo on the HP, Scodix & Highcon Euclid digital cutting and creasing machine. By joining the Open House event on Thursday, June 13th, 2019 from 11:30AM-4:30PM, guests will get inspired and learn about the Highcon capabilities.
Digital technologies enable agile production, improving the efficiency of marketing service providers. Coping with short runs of 100-1000 pages per job, print businesses today need to optimize their manufacturing workflow to fit customer needs, as marketing has to be both engaging and delivered close to real time.
Join us to learn more about the digital transformation, and how your business can stay ahead of the game by creating better customer engagement, optimizing your supply chain and reducing dramatically delivery time to market.
Agenda & Logistics:
The event will be held on Thursday, June 13th, 2019 from 11:30AM-4:30PM at Bennett Graphics.
Bennett Graphics, 125 Royal Woods Pkwy # 100, Tucker, GA 30084, USA
Thursday, June 13th, 2019
|12:00PM-12:45PM||Digital Workflow Strategy by HP, Scodix, Highcon|
|12:45PM-13:15PM||Bennett Graphics Site Tour|
|13:15PM-14:15PM||Group 1: HP Indigo Demo | Group 2: Scodix & Highcon Demo|
|14:15PM-15:15PM||Group 1: Scodix & Highcon Demo | Group 2: HP Indigo Demo|
|15:45PM-16:15PM||Bennett Graphics Success Story|
*Agenda and times might change. The final agenda will be sent to invitees by email, prior to the event.
Flights & Accommodation Options:
Registration is now available at this link. Please register by Thursday, June 6th, 2019.
Contact Information: For any inquiry please contact Michelle Harel via email at firstname.lastname@example.org or phone at +972 54 6801422
Can’t join us on June 13th, 2019 at Bennett Graphics, but interested in learning about the future Highcon Engage VIP Events? Click here and we will keep you updated!
Highcon is participating in one of the most influential corrugated packaging-focused trade shows in the Western Hemisphere, SuperCorrExpo, happening LIVE and IN-PERSON.
Highcon is proud to be among the sponsors of the 6th annual Digital Packaging Summit, this year going virtual. You have a chance to hear industry key experts from several segments including flexible packaging, folding carton corrugated application and more, that covers the key topics needed to understand opportunities, challenges, economic outlook, and critical decision-making criteria.
A virtual environment for suppliers of equipment and services around the world to connect with packaging producers. It is a platform where people can learn, interact and share information. Think of LinkedIn, but specifically for the packaging industry!