Dscoop 9, Orlando, FL

March 6-8, 2014

Highcon joined Dscoop9 at Orlando, Florida on March 6-8, 2014, as a Bronze Sponsor.
The slogan for this year’s event “Break the Mold” was perfect to describe the benefits of the Highcon Euclid digital cutting and creasing machine which offers printers and converters an innovative and flexible digital post-print solution with no need for a die.
On Highcon booth #1004 we presented a range of packaging and promotional items produced by Highcon and its customers.
Appearing for the first time at the Xeikon Café, the theme for the event is “How can digital production enhance and transform the label and packaging industry?” and “How can it turn short to medium runs into profitable business?”
On our booth at this 3 day event Highcon will present samples printed by Xeikon and digitally cut and creased on the Highcon Euclid.

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