Dscoop 9, Orlando, FL
March 6-8, 2014 - Orlando, Florida, USA
March 6-8, 2014 Orlando, Florida, USA Highcon joined Dscoop9 at Orlando, Florida on March 6-8, 2014, as a Bronze Sponsor.
The slogan for this year’s event “Break the Mold” was perfect to describe the benefits of the Highcon Euclid digital cutting and creasing machine which offers printers and converters an innovative and flexible digital post-print solution with no need for a die.
On Highcon booth #1004 we presented a range of packaging and promotional items produced by Highcon and its customers.
Appearing for the first time at the Xeikon Café, the theme for the event is “How can digital production enhance and transform the label and packaging industry?” and “How can it turn short to medium runs into profitable business?”
On our booth at this 3 day event Highcon will present samples printed by Xeikon and digitally cut and creased on the Highcon Euclid.
May 28th - June 7th, 2024 Düsseldorf, Germany August 28 - 30, 2023 Cleveland, Ohio October 25 - 27, 2023 Lyon, France Highcon exhibiting at the FEFCO Technical Seminar, 2023 on 25-27 October 2023 in Lyon Convention Centre