Highcon will be at VDW, the German Association of the Corrugated Board Industry to present our innovative solutions and discuss how to solve the crucial problems facing the packaging industry: short runs, production lead times and supply chain problems, combined with the growing demand for greener products.

Dedicated to the needs of the German corrugated industry, the 29^th Technical General Meeting of the VDW, takes place 14-15 November, 2022, at the Lufthansa Conference hotel in Seeheim-Jugenheim, Germany. Meet us at stand #28!

The event attracts hundreds of key decision-makers from across the corrugated and printing sectors, looking towards the next generation of solutions set to drive the market, including automation and digitization. At the event Highcon will highlight the business value of digital finishing solutions for the corrugated packaging and display industry and explain how users are benefiting from faster turnaround times, for small jobs, eliminating backlogs and lowering costs.

For more information, contact us at [email protected]