Highcon Beam Live Demo Broadcast
Highcon Beam live demonstration – Monday Sep. 26th, 2016 Thank you for watching the live demonstration of the Highcon Beam digital cutting and creasing machine for mainstream production. Duri...
Xeikon Cafe on Folding Carton
Highcon will be attending the Xeikon Cafe Folding Carton event in Lier, Belgium. Glossop Cartons, a customer of both Xeikon and Highcon will be addressing the attendees, as will a Highcon represent...
The Post drupa Report in NYC
Thursday, August 18, 2016, NYC Printing Industries Alliance is sponsoring The Post Drupa Report in NYC on Thursday, August 18, 2016. PIA just announced that HP, Muller Martini, GMG, Highcon, Canon,...
Packaging News Live 2016
Packaging News Live 2016 at the Olympia Conference Centre. Highcon is a premium sponsor of Packaging News Live 2016 which promises to bring the very best insight on packaging innovation, manufactur...
ECMA Congress 2016
The ECMA Annual Congress will take place from 14 until 17 September 2016 in Antibes/Juan-les-Pins in the South of France. Eshchar Ben-Shitrit, VP Marketing and Jens-Henrik, VP Global Sales, will be...
Architects of Tomorrow – Dscoop San Antonio
April 14-16, 2016 Join us at Dscoop San Antonio at booths 528/530 to see the latest exciting developments from Highcon. You won’t want to miss the chance to hear how digital finishing has imp...
drupa 2016
drupa 2016 May 31 – June 10, 2016, Dusseldorf, Germany Thank you to all the visitors, customers, partners and press who visited our booth at drupa 2016. The show was a great success for Highc...
Dscoop EMEA 2016 in Israel
Dscoop EMEA 2016 in Israel April 5-9, 2016 Dscoop EMEA 2016 in Israel, will be taking place in Tel-Aviv and Kiryat Gat. With over 700 attendees expected to visit HP demo center in Kiryat Gat, where...
DSCOOP ASIA 2015 & IGAS
DSCOOP ASIA 2015 & IGAS September 13-15, 2015 Join us at the Dscoop Asia 2015 Conference in Tokyo, Japan from 13-15 September 2015! Co-located with IGAS2015, the key theme of Dscoop Asia 2015 i...
Dscoop 9, Orlando, FL
Dscoop 9, Orlando, FL March 6-8, 2014 Highcon joined Dscoop9 at Orlando, Florida on March 6-8, 2014, as a Bronze Sponsor. The slogan for this year’s event “Break the Mold” was perfect t...
Xeikon Café 2014
Xeikon Café 2014 May 20-22, 2014 Appearing for the first time at the Xeikon Café, the theme for the event is “How can digital production enhance and transform the label and packaging industry...
Dscoop Asia
Dscoop Asia June 12-13, 2014 DSCOOP is a great venue for Highcon’s first appearance in Asia. HP customers who already appreciate the advantages of a totally digital workflow will be able to l...
CPP Expo & Graph Expo 2014
CPP Expo & Graph Expo 2014 September 28 – October 1, 2014 Highcon will be introducing the new generation Highcon Euclid digital cutting and creasing machine for the first time at Graph Ex...
PACE – Packaging and Converting Executive Forum
PACE – Packaging and Converting Executive Forum February 10-12, 2015 Eitan Varon, Highcon Executive Vice President will be talking about Adding Value with Digital Finishing. Outlining how dig...
Hunkeler Innovationdays
Hunkeler Innovationdays February 23-26, 2015 This is the first time Highcon will be exhibiting at the Hunkeler Innovationdays, with new samples digitally cut & creased by the Highcon Euclid mac...