Yavne, Israel, May 10, 2017; Highcon will be returning this year for the fourth time to the IADD FSEA Odyssey, being held this year from May 17-19 in Schaumburg, IL.
At this year’s event, Highcon will be showcasing not only the wide range of innovative samples produced by our customers worldwide, but also the core technology behind the revolutionary Highcon digital cutting and creasing machines – the DART and how it works. (Digital Adhesive Rule Technology). Visitors to the event are also offered an opportunity to see the Highcon Euclid III machine in action at the Komori Graphic Technology Center on Friday, May 19. Transport will be available for anyone registering at http://www.highcon.net/events/iadd-fsea-odyssey/
Ron Kukla, Highcon Director of Sales, Americas said “This event is important to us because it allows us direct contact with the people who can best appreciate our revolutionary technology and can provide the most valuable insight into its future. Many of Highcon’s customers around the globe are reaping the benefits of running both digital and analogue finishing side by side. The introduction of the digital technology not only allows our customers more design freedom and the ability to handle shorter runs profitably, it also frees up conventional die cutters, thus improving efficiency.”
On Friday May 19th at 9 a.m., Jim Smith, Highcon Pre-Sales Application Engineer will be talking about Digital Finishing for Mainstream Production, explaining how digital cutting and creasing for folding cartons, N, F, G and E flute can bridge the gap between design creativity and production capability. Highcon solutions streamline the process and turn “finishing” into a value-adding process.
The IADD•FSEA Odyssey is the only event in 2017 targeted specifically to diecutting, diemaking, foil stamping, embossing and bindery. Attendees at this exhibition are guaranteed a unique, world-class amalgam of education and technology. The Odyssey focuses on innovative processes, next generation materials, and unique industry services.
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