London, UK   /  

Packaging News Live 2016

Packaging News Live 2016 at the Olympia Conference Centre. Highcon is a premium sponsor of Packaging News Live 2016 which promises to bring the very best insight on packaging innovation, manufactur...
Antibes, France   /  

ECMA Congress 2016

The ECMA Annual Congress will take place from 14 until 17 September 2016 in Antibes/Juan-les-Pins in the South of France. Eshchar Ben-Shitrit, VP Marketing and Jens-Henrik, VP Global Sales, will be...
San Antonio, TX   /  

Architects of Tomorrow – Dscoop San Antonio

April 14-16, 2016 Join us at Dscoop San Antonio at booths 528/530 to see the latest exciting developments from Highcon. You won’t want to miss the chance to hear how digital finishing has imp...
Dusseldorf, Germany   /  

drupa 2016

drupa 2016 May 31 – June 10, 2016, Dusseldorf, Germany Thank you to all the visitors, customers, partners and press who visited our booth at drupa 2016. The show was a great success for Highc...
Tel Aviv, Israel   /  

Dscoop EMEA 2016 in Israel

Dscoop EMEA 2016 in Israel April 5-9, 2016 Dscoop EMEA 2016 in Israel, will be taking place in Tel-Aviv and Kiryat Gat. With over 700 attendees expected to visit HP demo center in Kiryat Gat, where...
Tokyo, Japan   /  

DSCOOP ASIA 2015 & IGAS

DSCOOP ASIA 2015 & IGAS September 13-15, 2015 Join us at the Dscoop Asia 2015 Conference in Tokyo, Japan from 13-15 September 2015! Co-located with IGAS2015, the key theme of Dscoop Asia 2015 i...
Orlando, Florida, USA   /  

Dscoop 9, Orlando, FL

Dscoop 9, Orlando, FL March 6-8, 2014 Highcon joined Dscoop9 at Orlando, Florida on March 6-8, 2014, as a Bronze Sponsor. The slogan for this year’s event “Break the Mold” was perfect t...
Antwerp, Belgium   /  

Xeikon Café 2014

Xeikon Café 2014 May 20-22, 2014 Appearing for the first time at the Xeikon Café, the theme for the event is “How can digital production enhance and transform the label and packaging industry...
Bali, Indonesia   /  

Dscoop Asia

Dscoop Asia June 12-13, 2014 DSCOOP is a great venue for Highcon’s first appearance in Asia. HP customers who already appreciate the advantages of a totally digital workflow will be able to l...
Chicago, USA   /  

CPP Expo & Graph Expo 2014

CPP Expo & Graph Expo 2014 September 28 – October 1, 2014 Highcon will be introducing the new generation Highcon Euclid digital cutting and creasing machine for the first time at Graph Ex...
Brussels, Belgium   /  

PACE – Packaging and Converting Executive Forum

PACE – Packaging and Converting Executive Forum February 10-12, 2015 Eitan Varon, Highcon Executive Vice President will be talking about Adding Value with Digital Finishing. Outlining how dig...
Lucerne, Switzerland   /  

Hunkeler Innovationdays

Hunkeler Innovationdays February 23-26, 2015 This is the first time Highcon will be exhibiting at the Hunkeler Innovationdays, with new samples digitally cut & creased by the Highcon Euclid mac...
Washington D.C, USA   /  

DscoopX, USA

DscoopX, USA March 5-7, 2015, Washington D.C, USA After exhibiting in last year’s Dscoop USA in Orlando, and Dscoop APJ in Bali, this year Highcon will exhibit as a Gold Partner in DscoopX. O...
Lier, Belgium   /  

Xeikon Café 2014

Xeikon Café 2014 March 10-12, 2014 For the second year in a row, Highcon is continuing their successful collaboration with Xeikon, and will take part in the second Xeikon Café event. For this event...
Dongguan, China   /  

Print China 2015

Print China 2015 April 7-12, 2015 First appearance of the Highcon Euclid II+ machine in Asia! Together with Infotech, Highcon’s partner in China. We will launch the Euclid II+ on our booth, p...
Chicago, USA   /  

IADD FSEA Odyssee

IADD FSEA Odyssee May 13-15, 2015, Chicago, IL After a major focus on the 2013 IADD event, Highcon exhibited for the second time at the 2015 IADD FSEA Odyssey. Vic Stalam, President, Highcon Americ...